Business Scope
Nanomaterials, semiconductor materials, high-purity materials, custom processing
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM
address
Zhengzhou, Henan, China
Business Scope
Nanomaterials, semiconductor materials, high-purity materials, custom processing
Work Hours
Monday to Friday: 7AM - 7PM
Weekend: 10AM - 5PM
address
Zhengzhou, Henan, China
The LEC Crucible, a pivotal component in the Liquid Encapsulation Control (LEC) method, which utilizes a liquid cover agent to effectively seal the melt and control volatile components for optimal semiconductor crystal growth. The LEC Crucible serves primarily as a growth container essential for the liquid encapsulated crystal pulling technique (LEC) in single crystal production.
Product Features:
– High Purity: Achieving an exceptional purity level of 99.999%, the LEC Crucible ensures minimal contamination, making it ideal for high-quality crystalline growth.
– Non-Wetting with Molten Metals: The crucible’s unique composition prevents wetting with molten metals, which is critical for maintaining the integrity of your semiconductor materials.
– Controllable Thermal Conductivity: Designed for optimal performance, the LEC Crucible allows for efficient control of thermal conductivity, significantly enhancing the crystallization rate.
– Excellent Thermal Shock Resistance: The crucible withstands rapid temperature changes, ensuring durability and reliability in high-stress environments.
– Easy to Clean and Reusable: The LEC Crucible is designed for convenience, facilitating easy cleaning and allowing for multiple uses without compromising performance.
– Chemical Inertness: Engineered to resist chemical reactions with acids and bases even at elevated temperatures, this crucible guarantees safety and stability during your semiconductor processing.
Upgrade your semiconductor crystal growth process with the high-performance LEC Crucible. Its superior features are tailored to meet the demanding needs of crystal fabrication, delivering outstanding results every time.
specification:
Application | Inside Diameter | Height | Thickness |
LEC | 3″ | 3″ | 0.03″ |
LEC | 4″ | 4″ | 0.035″ |
LEC | 5″ | 5″ | 0.035″ |
LEC | 6″ | 6″ | 0.04″ |
LEC | 7″ | 7″ | 0.04″ |
LEC | 8″ | 8″ | 0.04″ |
LEC | 14″ | 14″ | 0.08″ |
parameter:
Properties | Units | Values |
Density | g/cm3 | 1.95-2.20 |
Tensile Strength | MPa | 112 |
Bending Strength | MPa | 173 |
Compression Strength | MPa | 154 |
Young’s Modulus | GPa | 18 |
Thermal Conductivity | W/m°C | “a” 60 “c” 2 |
Specific Heat | J/g·℃ | 0.90(RT) |
Resistivity | Ω.cm | 2×1015 |
Dielectric Strength | D.C. volts/mm | 2×1015 |
Dielectric Constant | “c” 3.07 | |
Metal Impurity Content | ppm | <10 |